DIFF Subgroup
H10W 10/10 Isolation regions comprising dielectric materials
Introduced: January 2026
Full Title
Isolation regions in semiconductor bodies between components of integrated devices > Isolation regions comprising dielectric materials
Of 3 combined children, 2 exist in both systems.
1 codes are CPC-only extensions.
IPC defines codes here since 2026.
Child Classifications
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- H10W 10/13 formed using local oxidation of silicon [LOCOS], e.g. sealed interface localised oxidation [SILO] or side-wall mask isolation [SWAMI] since 2026 IPC+CPC Available in IPC and CPC
- H10W 10/17 formed using trench refilling with dielectric materials, e.g. shallow trench isolations since 2026 IPC+CPC Available in IPC and CPC