Skip to content
PCE
Search Classifications
Search for IPC and CPC classification codes or keywords
DIFF Subgroup
H10W 20/482

Full Title

Interconnections in chips, wafers or substrates > Interconnections external to wafers or substrates, e.g. back-end-of-line [BEOL] metallisations or vias connecting to gate electrodes

Of 2 combined children, 0 exist in both systems.

2 codes are CPC-only extensions.