DIFF Subgroup
H10W 20/40 Interconnections external to wafers or substrates, e.g. back-end-of-line [BEOL] metallisations or vias connecting to gate electrodes
Introduced: January 2026
Full Title
Interconnections in chips, wafers or substrates > Interconnections external to wafers or substrates, e.g. back-end-of-line [BEOL] metallisations or vias connecting to gate electrodes
CPC subdivides this area 3x more granularly than IPC with 5 additional codes.
5 codes are CPC-only extensions.
IPC defines codes here since 2026.
Child Classifications
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- H10W 20/41 characterised by their conductive parts since 2026 +5 CPC IPC+CPC Available in IPC and CPC
- H10W 20/45 characterised by their insulating parts since 2026 +1 CPC IPC+CPC Available in IPC and CPC
- H10W 20/49 Adaptable interconnections, e.g. fuses or antifuses since 2026 +2 CPC IPC+CPC Available in IPC and CPC