H10W 20/493 — IPC vs CPC Diff | Patent Classification Explorer

DIFF Subgroup

H10W 20/493

Full Title

Interconnections in chips, wafers or substrates > Interconnections external to wafers or substrates, e.g. back-end-of-line [BEOL] metallisations or vias connecting to gate electrodes > Adaptable interconnections, e.g. fuses or antifuses

Of 1 combined children, 0 exist in both systems.

1 codes are CPC-only extensions.

This code exists only in CPC.

Diff view requires codes present in both systems.

View in CPC →