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PCE
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Search for IPC and CPC classification codes or keywords
DIFF Subgroup
H10W 20/495

Full Title

Interconnections in chips, wafers or substrates > Interconnections external to wafers or substrates, e.g. back-end-of-line [BEOL] metallisations or vias connecting to gate electrodes

Of 1 combined children, 0 exist in both systems.

1 codes are CPC-only extensions.