H10W 70/24 — IPC vs CPC Diff | Patent Classification Explorer

DIFF Subgroup

H10W 70/24

Full Title

Package substrates; Interposers; Redistribution layers [RDL] > Conductive package substrates serving as an interconnection, e.g. metal plates (leadframes H10W70/40)

Of 2 combined children, 0 exist in both systems.

2 codes are CPC-only extensions.

This code exists only in CPC.

Diff view requires codes present in both systems.

View in CPC →