Package substrates; Interposers; Redistribution layers [RDL]

Introduced: January 2026

Of 5 combined children, 4 exist in both systems.

1 codes are CPC-only extensions.

2 shared codes have differing titles between IPC and CPC.

IPC defines codes here since 2026.

Child Classifications

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H10W 70/01 Manufacture or treatment since 2026 IPC+CPC Available in IPC and CPC
H10W 70/099 CPC only CPC only
H10W 70/20 Conductive package substrates serving as an interconnection, e.g. metal plates (leadframes H10W70/40) since 2026 +2 CPC IPC+CPC Available in IPC and CPC
H10W 70/40 Leadframes since 2026 +12 CPC IPC+CPC Available in IPC and CPC
H10W 70/60 Insulating or insulated package substrates; Interposers; Redistribution layers (leadframes H10W70/40) since 2026 +2 CPC IPC+CPC Available in IPC and CPC