Bump connectors, e.g. solder bumps or copper pillars; Dummy bumps; Thermal bumps

Introduced: January 2026

Full Title

Interconnections or connectors in packages > Bump connectors, e.g. solder bumps or copper pillars; Dummy bumps; Thermal bumps

CPC subdivides this area 7x more granularly than IPC with 6 additional codes.

6 codes are CPC-only extensions.

IPC defines codes here since 2026.

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H10W 72/221 +5 CPC CPC only CPC only
H10W 72/231 +4 CPC CPC only CPC only
H10W 72/241 +4 CPC CPC only CPC only
H10W 72/251 +4 CPC CPC only CPC only
H10W 72/261 +3 CPC CPC only CPC only
H10W 72/281 +3 CPC CPC only CPC only
H10W 72/29 Bond pads specially adapted therefor since 2026 IPC+CPC Available in IPC and CPC