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IPC Subgroup
H10W 72/2

Bump connectors, e.g. solder bumps or copper pillars; Dummy bumps; Thermal bumps

Introduced: January 2026

Full Title

Interconnections or connectors in packages > Bump connectors, e.g. solder bumps or copper pillars; Dummy bumps; Thermal bumps

Classification Context

Section:
ELECTRICITY
Class:
SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
Subclass:
GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS

Additional Content

bump connector bump connectors a bump that provides electrical connection. Examples include solder balls or copper pillars.an electrically-conductive connector on the electrodes or bond pads of a chip or package part, for electrical connection between objects. Examples include solder balls or copper pillars. dummy bump dummy bumps a bump having similar properties to a bump connector (such as shape or material), for purposes other than electrical connection, such as mechanical connection. thermal bump thermal bumps a bump having similar properties to a bump connector (such as shape or material), for purposes other than electrical connection, such as for thermal connection between objects.

1 direct subcode

Child Classifications

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Top Applicants

Top 10 applicants by patent filingsfor class H10, 2013–2023, worldwide · Source: EPO PATSTAT

  1. SAMSUNG DISPLAY KR 21,044
  2. SAMSUNG ELECTRONICS COMPANY KR 14,774
  3. LG DISPLAY COMPANY KR 9,454
  4. TAIWAN SEMICONDUCTOR MANUFACTURING COMPANY TW 8,301
  5. SEMICONDUCTOR ENERGY LABORATORY COMPANY JP 7,642
  6. BOE TECHNOLOGY GROUP COMPANY 6,845
  7. BOE TECHNOLOGY GROUP COMPANY CN 6,806
  8. SAMSUNG DISPLAY 6,577
  9. LG CHEM KR 5,461
  10. SEMICONDUCTOR ENERGY LABORATORY COMPANY 5,115