Interconnections or connectors in packages

Child Classifications

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• H10W 72/01 +8 CPC CPC only CPC only
• H10W 72/071 +7 CPC CPC only CPC only
• H10W 72/20 Bump connectors, e.g. solder bumps or copper pillars; Dummy bumps; Thermal bumps since 2026 +6 CPC IPC+CPC Available in IPC and CPC
• H10W 72/30 Die-attach connectors since 2026 +6 CPC IPC+CPC Available in IPC and CPC
• H10W 72/40 Anisotropic conductive adhesives since 2026 IPC+CPC Available in IPC and CPC
• H10W 72/50 Bond wires since 2026 +5 CPC IPC+CPC Available in IPC and CPC
• H10W 72/60 Strap connectors, e.g. thick copper clips for grounding of power devices since 2026 +6 CPC IPC+CPC Available in IPC and CPC
• H10W 72/701 +1 CPC CPC only CPC only
• H10W 72/801 CPC only CPC only
• H10W 72/812 CPC only CPC only
• H10W 72/823 CPC only CPC only
• H10W 72/834 CPC only CPC only
• H10W 72/851 +2 CPC CPC only CPC only
• H10W 72/90 Bond pads, in general since 2026 +6 CPC IPC+CPC Available in IPC and CPC