DIFF Main Group
H10W 72/00 Interconnections or connectors in packages
Introduced: January 2026
CPC subdivides this area 2x more granularly than IPC with 8 additional codes.
8 codes are CPC-only extensions.
IPC defines codes here since 2026.
Child Classifications
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- H10W 72/20 Bump connectors, e.g. solder bumps or copper pillars; Dummy bumps; Thermal bumps since 2026 +6 CPC IPC+CPC Available in IPC and CPC
- H10W 72/60 Strap connectors, e.g. thick copper clips for grounding of power devices since 2026 +6 CPC IPC+CPC Available in IPC and CPC