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IPC Subgroup
G01R 31/71

Testing of solder joints

Introduced: January 2020

Full Title

Arrangements for testing electric properties; Arrangements for locating electric faults; Arrangements for electrical testing characterised by what is being tested not provided for elsewhere > Testing of electric apparatus, lines, cables or components for short-circuits, continuity, leakage current or incorrect line connections > Testing of connections, e.g. of plugs or non-disconnectable joints > Testing of connections between components and printed circuit boards > Testing of solder joints

Classification Context

Section:
PHYSICS
Class:
MEASURING; TESTING
Subclass:
MEASURING ELECTRIC VARIABLES; MEASURING MAGNETIC VARIABLES

Top Applicants

Top 10 applicants by patent filingsfor class G01, 2013–2023, worldwide · Source: EPO PATSTAT

  1. SGCC(STATE GRID CORPORATION OF CHINA) 41,447
  2. CHINESE ACADEMY OF SCIENCES 32,952
  3. ROBERT BOSCH DE 16,470
  4. SAMSUNG ELECTRONICS COMPANY KR 10,052
  5. SINOPEC (CHINA PETROCHEMICAL CORPORATION) 9,573
  6. ZHEJIANG UNIVERSITY 9,529
  7. GUANGDONG POWER GRID CORPORATION 8,615
  8. TSINGHUA UNIVERSITY 7,805
  9. HALLIBURTON ENERGY SERVICES GROUP US 7,796
  10. QUALCOMM US 7,171