IPC Subgroup
H04N 25/76 Addressed sensors, e.g. MOS or CMOS sensors
Introduced: January 2023
Full Title
Circuitry of solid-state image sensors [SSIS]; Control thereof > SSIS architectures; Circuits associated therewith > Addressed sensors, e.g. MOS or CMOS sensors
Classification Context
- Section:
- ELECTRICITY
- Class:
- ELECTRIC COMMUNICATION TECHNIQUE
- Subclass:
- PICTORIAL COMMUNICATION, e.g. TELEVISION
6 direct subcodes
Child Classifications
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- H04N 25/766 comprising control or output lines used for a plurality of functions, e.g. for pixel output, driving, reset or power
- H04N 25/767 Horizontal readout lines, multiplexers or registers
- H04N 25/768 for time delay and integration [TDI]
- H04N 25/77 Pixel circuitry, e.g. memories, A/D converters, pixel amplifiers, shared circuits or shared components
- H04N 25/779 Circuitry for scanning or addressing the pixel array
- H04N 25/78 Readout circuits for addressed sensors, e.g. output amplifiers or A/D converters
Top Applicants
Top 10 applicants by patent filingsfor class H04, 2013–2023, worldwide · Source: EPO PATSTAT
- QUALCOMM US 97,396
- HUAWEI TECHNOLOGIES COMPANY CN 96,502
- SAMSUNG ELECTRONICS COMPANY KR 86,981
- TELEFONAKTIEBOLAGET LM ERICSSON (PUBL) SE 55,869
- HUAWEI TECHNOLOGIES COMPANY 55,349
- LG ELECTRONICS KR 53,649
- CANON 33,341
- SONY CORPORATION JP 32,761
- ZTE CORPORATION CN 32,274
- GUANGDONG OPPO MOBILE TELECOMMUNICATIONS CORPORATION 28,327