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IPC Subgroup
H04N 25/76

Addressed sensors, e.g. MOS or CMOS sensors

Introduced: January 2023

Full Title

Circuitry of solid-state image sensors [SSIS]; Control thereof > SSIS architectures; Circuits associated therewith > Addressed sensors, e.g. MOS or CMOS sensors

Classification Context

Section:
ELECTRICITY
Class:
ELECTRIC COMMUNICATION TECHNIQUE
Subclass:
PICTORIAL COMMUNICATION, e.g. TELEVISION

6 direct subcodes

Child Classifications

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  • H04N 25/766 comprising control or output lines used for a plurality of functions, e.g. for pixel output, driving, reset or power
  • H04N 25/767 Horizontal readout lines, multiplexers or registers
  • H04N 25/768 for time delay and integration [TDI]
  • H04N 25/779 Circuitry for scanning or addressing the pixel array
  • H04N 25/78 Readout circuits for addressed sensors, e.g. output amplifiers or A/D converters

Top Applicants

Top 10 applicants by patent filingsfor class H04, 2013–2023, worldwide · Source: EPO PATSTAT

  1. QUALCOMM US 97,396
  2. HUAWEI TECHNOLOGIES COMPANY CN 96,502
  3. SAMSUNG ELECTRONICS COMPANY KR 86,981
  4. TELEFONAKTIEBOLAGET LM ERICSSON (PUBL) SE 55,869
  5. HUAWEI TECHNOLOGIES COMPANY 55,349
  6. LG ELECTRONICS KR 53,649
  7. CANON 33,341
  8. SONY CORPORATION JP 32,761
  9. ZTE CORPORATION CN 32,274
  10. GUANGDONG OPPO MOBILE TELECOMMUNICATIONS CORPORATION 28,327