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IPC Subgroup
H04N 25/71

Charge-coupled device [CCD] sensors; Charge-transfer registers specially adapted for CCD sensors

Introduced: January 2023

Full Title

Circuitry of solid-state image sensors [SSIS]; Control thereof > SSIS architectures; Circuits associated therewith > Charge-coupled device [CCD] sensors; Charge-transfer registers specially adapted for CCD sensors

Classification Context

Section:
ELECTRICITY
Class:
ELECTRIC COMMUNICATION TECHNIQUE
Subclass:
PICTORIAL COMMUNICATION, e.g. TELEVISION

Filing statistics

IPC H04N 25/71 belongs to the parent subclass H04N, which recorded 1,015,361 patent applications worldwide between 2013 and 2023. Annual filings grew from 76,403 in 2013 to 85,701 in 2023 (+12%), peaking at 118,798 applications in 2020. The most active applicants in class H04 are QUALCOMM (97,396 applications), HUAWEI TECHNOLOGIES COMPANY (96,502 applications) and SAMSUNG ELECTRONICS COMPANY (86,981 applications).

Source: EPO PATSTAT, worldwide filings

7 direct subcodes

Child Classifications

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  • H04N 25/711 Time delay and integration [TDI] registers; TDI shift registers
  • H04N 25/713 Transfer or readout registers; Split readout registers or multiple readout registers
  • H04N 25/715 using frame interline transfer [FIT]
  • H04N 25/72 using frame transfer [FT]
  • H04N 25/73 using interline transfer [IT]
  • H04N 25/74 Circuitry for scanning or addressing the pixel array
  • H04N 25/75 Circuitry for providing, modifying or processing image signals from the pixel array

Top Applicants

Top 10 applicants by patent filingsfor class H04, 2013–2023, worldwide · Source: EPO PATSTAT

  1. QUALCOMM US 97,396
  2. HUAWEI TECHNOLOGIES COMPANY CN 96,502
  3. SAMSUNG ELECTRONICS COMPANY KR 86,981
  4. TELEFONAKTIEBOLAGET LM ERICSSON (PUBL) SE 55,869
  5. HUAWEI TECHNOLOGIES COMPANY 55,349
  6. LG ELECTRONICS KR 53,649
  7. CANON 33,341
  8. SONY CORPORATION JP 32,761
  9. ZTE CORPORATION CN 32,274
  10. GUANGDONG OPPO MOBILE TELECOMMUNICATIONS CORPORATION 28,327