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IPC Subgroup
H04N 25/71

Charge-coupled device [CCD] sensors; Charge-transfer registers specially adapted for CCD sensors

Introduced: January 2023

Full Title

Circuitry of solid-state image sensors [SSIS]; Control thereof > SSIS architectures; Circuits associated therewith > Charge-coupled device [CCD] sensors; Charge-transfer registers specially adapted for CCD sensors

Classification Context

Section:
ELECTRICITY
Class:
ELECTRIC COMMUNICATION TECHNIQUE
Subclass:
PICTORIAL COMMUNICATION, e.g. TELEVISION

7 direct subcodes

Child Classifications

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  • H04N 25/711 Time delay and integration [TDI] registers; TDI shift registers
  • H04N 25/713 Transfer or readout registers; Split readout registers or multiple readout registers
  • H04N 25/715 using frame interline transfer [FIT]
  • H04N 25/72 using frame transfer [FT]
  • H04N 25/73 using interline transfer [IT]
  • H04N 25/74 Circuitry for scanning or addressing the pixel array
  • H04N 25/75 Circuitry for providing, modifying or processing image signals from the pixel array

Top Applicants

Top 10 applicants by patent filingsfor class H04, 2013–2023, worldwide · Source: EPO PATSTAT

  1. QUALCOMM US 97,396
  2. HUAWEI TECHNOLOGIES COMPANY CN 96,502
  3. SAMSUNG ELECTRONICS COMPANY KR 86,981
  4. TELEFONAKTIEBOLAGET LM ERICSSON (PUBL) SE 55,869
  5. HUAWEI TECHNOLOGIES COMPANY 55,349
  6. LG ELECTRONICS KR 53,649
  7. CANON 33,341
  8. SONY CORPORATION JP 32,761
  9. ZTE CORPORATION CN 32,274
  10. GUANGDONG OPPO MOBILE TELECOMMUNICATIONS CORPORATION 28,327