H05K 1/18 structurally associated with non-printed electric components
Introduced: September 1968
Last revised: January 2026
Full Title
Printed circuits > structurally associated with non-printed electric components
Classification Context
- Section:
- ELECTRICITY
- Class:
- ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- Subclass:
- PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
Filing statistics
IPC H05K 1/18 belongs to the parent subclass H05K, which recorded 723,133 patent applications worldwide between 2013 and 2023. Annual filings grew from 35,232 in 2013 to 99,745 in 2023 (+183%), peaking at 100,204 applications in 2021. The most active applicants in class H05 are SAMSUNG ELECTRONICS COMPANY (7,201 applications), PANASONIC INTELLECTUAL PROPERTY (6,828 applications) and SEMICONDUCTOR ENERGY LABORATORY COMPANY (3,988 applications).
Source: EPO PATSTAT, worldwide filings
3 direct subcodes
Child Classifications
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- H05K 1/181 associated with surface mounted components
- H05K 1/182 associated with components mounted in printed circuit boards [PCB], e.g. insert-mounted components [IMC]
- H05K 1/189 characterised by the use of flexible or folded printed circuits
Top Applicants
Top 10 applicants by patent filingsfor class H05, 2013–2023, worldwide · Source: EPO PATSTAT
- SAMSUNG ELECTRONICS COMPANY KR 7,201
- PANASONIC INTELLECTUAL PROPERTY 6,828
- SEMICONDUCTOR ENERGY LABORATORY COMPANY 3,988
- LG ELECTRONICS KR 3,564
- PANASONIC INTELLECTUAL PROPERTY JP 3,533
- SAMSUNG DISPLAY KR 3,310
- FUJI JP 2,870
- SAMSUNG ELECTRO-MECHANICS COMPANY KR 2,675
- GUANGDONG OPPO MOBILE TELECOMMUNICATIONS CORPORATION 2,665
- MURATA MANUFACTURING COMPANY JP 2,634