IPC Subgroup
H05K 1/18 structurally associated with non-printed electric components
Introduced: September 1968
Last revised: January 2026
Full Title
Printed circuits > structurally associated with non-printed electric components
Classification Context
- Section:
- ELECTRICITY
- Class:
- ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- Subclass:
- PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
3 direct subcodes
Child Classifications
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- H05K 1/181 associated with surface mounted components
- H05K 1/182 associated with components mounted in printed circuit boards [PCB], e.g. insert-mounted components [IMC]
- H05K 1/189 characterised by the use of flexible or folded printed circuits
Top Applicants
Top 10 applicants by patent filingsfor class H05, 2013–2023, worldwide · Source: EPO PATSTAT
- SAMSUNG ELECTRONICS COMPANY KR 7,201
- PANASONIC INTELLECTUAL PROPERTY 6,828
- SEMICONDUCTOR ENERGY LABORATORY COMPANY 3,988
- LG ELECTRONICS KR 3,564
- PANASONIC INTELLECTUAL PROPERTY JP 3,533
- SAMSUNG DISPLAY KR 3,310
- FUJI JP 2,870
- SAMSUNG ELECTRO-MECHANICS COMPANY KR 2,675
- GUANGDONG OPPO MOBILE TELECOMMUNICATIONS CORPORATION 2,665
- MURATA MANUFACTURING COMPANY JP 2,634