PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS

Introduced: September 1968

Classification Context

Section:: ELECTRICITY
Class:: ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Subclass:: PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS

Description

Covers the design, manufacture, and assembly of printed circuit boards (PCBs), including circuit patterns, substrate materials, and interconnection technologies. Encompasses mechanical casings, enclosures, and structural components that house electrical apparatus, as well as manufacturing processes for assembling discrete electrical and electronic components onto circuit boards. Addresses thermal management, insulation, shielding, and interconnection methods for electronic equipment.

Scope Notes

Glossary: printed circuit printed circuits The expression covers all kinds of mechanical arrangements of circuits that consist of an insulating base or substrate, having at least one conductive layer permanently formed on the base. The base often extends in a two-dimensional [2D] plane. Other conductive layers may be formed in a layer structure within the base. The base may support components on its surface or between its layers. Each conductive layer is formed as separate patterns or tracks to connect the components as required. The expression is also applied adjectivally to processes or apparatus for manufacturing such circuits, e.g. by mechanical or chemical treatment of conductive foil, paste or film that has been applied to an insulating base, support or substrate. printed circuit board printed circuit boards a circuit board in/on which a printed circuit is formed. Various electronic components, such as semiconductor chips, capacitors and resistors, may be mounted thereon or embedded therein, while being electrically connected to the printed circuit. Electronic components may also be formed by printing. Single-sided or double-sided printed circuit boards typically have a structure where the insulating support forms the substrate on which the conductive patterned layer(s), i.e. the printed circuit, is/are provided. Multilayer printed circuit boards have a layered structure in which conductive layers and insulating materials are laminated in the form of a substrate, and interconnections can be provided, e.g. by through-holes, vias or internal layers. PCBs may be rigid, flexible, rigid-flex (a combination of both) or stretchable.

Related Keywords

mountings for facilitating ACCESS to electric apparatusASSEMBLIES of electric componentsprinted CIRCUITSassemblies of electric COMPONENTSPRINTED CIRCUITS in generalmountings for facilitating SERVICING of electric apparatusgeneral constructional aspects of equipment for TELECOMMUNICATIONradio receivers or transmitters combined with apparatus classified elsewheretelevision receivers or transmitters combined with apparatus classified elsewhere

8 direct subcodes

Child Classifications

Navigate with arrow keys, Enter to open

H05K 1/00 Printed circuits
H05K 10/00 Arrangements for improving the operating reliability of electronic equipment, e.g. by providing a similar stand-by unit
H05K 11/00 Combinations of a radio or television receiver with apparatus having a different main function
H05K 13/00 Apparatus or processes specially adapted for manufacturing or adjusting assemblages of electric components
H05K 3/00 Apparatus or processes for manufacturing printed circuits
H05K 5/00 Casings, cabinets or drawers for electric apparatus
H05K 7/00 Constructional details common to different types of electric apparatus
H05K 9/00 Screening of apparatus or components against electric or magnetic fields