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IPC Subgroup
H05K 3/08

the conductive material being removed by electric discharge, e.g. by spark erosion

Introduced: September 1968

Last revised: January 2006

Full Title

Apparatus or processes for manufacturing printed circuits > in which the conductive material is applied to the surface of the insulating support and is thereafter removed from such areas of the surface which are not intended for current conducting or shielding > the conductive material being removed by electric discharge, e.g. by spark erosion

Classification Context

Section:
ELECTRICITY
Class:
ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Subclass:
PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS

Top Applicants

Top 10 applicants by patent filingsfor class H05, 2013–2023, worldwide · Source: EPO PATSTAT

  1. SAMSUNG ELECTRONICS COMPANY KR 7,201
  2. PANASONIC INTELLECTUAL PROPERTY 6,828
  3. SEMICONDUCTOR ENERGY LABORATORY COMPANY 3,988
  4. LG ELECTRONICS KR 3,564
  5. PANASONIC INTELLECTUAL PROPERTY JP 3,533
  6. SAMSUNG DISPLAY KR 3,310
  7. FUJI JP 2,870
  8. SAMSUNG ELECTRO-MECHANICS COMPANY KR 2,675
  9. GUANGDONG OPPO MOBILE TELECOMMUNICATIONS CORPORATION 2,665
  10. MURATA MANUFACTURING COMPANY JP 2,634