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IPC Main Group
H05K 3/00

Apparatus or processes for manufacturing printed circuits

Introduced: September 1968

Last revised: January 2006

Classification Context

Section:
ELECTRICITY
Class:
ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Subclass:
PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS

Related Keywords

ASSEMBLING of printed circuits with electric components

9 direct subcodes

Child Classifications

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  • H05K 3/36 Assembling printed circuits with other printed circuits
  • H05K 3/38 Improvement of the adhesion between the insulating substrate and the metal
  • H05K 3/44 Manufacturing insulated metal core circuits
  • H05K 3/46 Manufacturing multi-layer circuits

Top Applicants

Top 10 applicants by patent filingsfor class H05, 2013–2023, worldwide · Source: EPO PATSTAT

  1. SAMSUNG ELECTRONICS COMPANY KR 7,201
  2. PANASONIC INTELLECTUAL PROPERTY 6,828
  3. SEMICONDUCTOR ENERGY LABORATORY COMPANY 3,988
  4. LG ELECTRONICS KR 3,564
  5. PANASONIC INTELLECTUAL PROPERTY JP 3,533
  6. SAMSUNG DISPLAY KR 3,310
  7. FUJI JP 2,870
  8. SAMSUNG ELECTRO-MECHANICS COMPANY KR 2,675
  9. GUANGDONG OPPO MOBILE TELECOMMUNICATIONS CORPORATION 2,665
  10. MURATA MANUFACTURING COMPANY JP 2,634