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PCE
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IPC Subgroup
H05K 3/02

in which the conductive material is applied to the surface of the insulating support and is thereafter removed from such areas of the surface which are not intended for current conducting or shielding

Introduced: September 1968

Last revised: January 2006

Full Title

Apparatus or processes for manufacturing printed circuits > in which the conductive material is applied to the surface of the insulating support and is thereafter removed from such areas of the surface which are not intended for current conducting or shielding

Classification Context

Section:
ELECTRICITY
Class:
ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Subclass:
PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS

3 direct subcodes

Child Classifications

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  • H05K 3/04 the conductive material being removed mechanically, e.g. by punching
  • H05K 3/08 the conductive material being removed by electric discharge, e.g. by spark erosion