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IPC Subgroup
H05K 3/346

Solder materials or compositions specially adapted therefor

Introduced: January 2026

Full Title

Apparatus or processes for manufacturing printed circuits > Assembling printed circuits with electric components, e.g. with resistors > electrically connecting electric components or wires to printed circuits > by soldering > Solder materials or compositions specially adapted therefor

Classification Context

Section:
ELECTRICITY
Class:
ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Subclass:
PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS

Top Applicants

Top 10 applicants by patent filingsfor class H05, 2013–2023, worldwide · Source: EPO PATSTAT

  1. SAMSUNG ELECTRONICS COMPANY KR 7,201
  2. PANASONIC INTELLECTUAL PROPERTY 6,828
  3. SEMICONDUCTOR ENERGY LABORATORY COMPANY 3,988
  4. LG ELECTRONICS KR 3,564
  5. PANASONIC INTELLECTUAL PROPERTY JP 3,533
  6. SAMSUNG DISPLAY KR 3,310
  7. FUJI JP 2,870
  8. SAMSUNG ELECTRO-MECHANICS COMPANY KR 2,675
  9. GUANGDONG OPPO MOBILE TELECOMMUNICATIONS CORPORATION 2,665
  10. MURATA MANUFACTURING COMPANY JP 2,634