by soldering

Introduced: September 1968

Last revised: January 2026

Full Title

Apparatus or processes for manufacturing printed circuits > Assembling printed circuits with electric components, e.g. with resistors > electrically connecting electric components or wires to printed circuits > by soldering

Classification Context

Section:: ELECTRICITY
Class:: ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Subclass:: PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS

Related Keywords

SOLDERING of printed circuits by dip or wave SOLDERING

7 direct subcodes

Child Classifications

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H05K 3/341 Surface mounted components
H05K 3/3447 Lead-in-hole components
H05K 3/3452 Solder masks
H05K 3/346 Solder materials or compositions specially adapted therefor
H05K 3/3465 Application of solder
H05K 3/3489 Composition of fluxes; Application thereof; Other processes of activating the contact surfaces
H05K 3/3494 Heating processes for reflow soldering