IPC Subgroup
H05K 3/38 Improvement of the adhesion between the insulating substrate and the metal
Introduced: January 1980
Last revised: January 2006
Full Title
Apparatus or processes for manufacturing printed circuits > Improvement of the adhesion between the insulating substrate and the metal
Classification Context
- Section:
- ELECTRICITY
- Class:
- ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- Subclass:
- PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS