Forming printed elements for providing electric connections to or between printed circuits

Introduced: January 1980

Last revised: January 2006

Full Title

Apparatus or processes for manufacturing printed circuits > Forming printed elements for providing electric connections to or between printed circuits

Classification Context

Section:: ELECTRICITY
Class:: ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Subclass:: PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS

1 direct subcode

Child Classifications

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H05K 3/42 Plated through-holes

Top Applicants

Top 10 applicants by patent filingsfor class H05, 2013–2023, worldwide · Source: EPO PATSTAT

SAMSUNG ELECTRONICS COMPANY KR 7,201
PANASONIC INTELLECTUAL PROPERTY 6,828
SEMICONDUCTOR ENERGY LABORATORY COMPANY 3,988
LG ELECTRONICS KR 3,564
PANASONIC INTELLECTUAL PROPERTY JP 3,533
SAMSUNG DISPLAY KR 3,310
FUJI JP 2,870
SAMSUNG ELECTRO-MECHANICS COMPANY KR 2,675
GUANGDONG OPPO MOBILE TELECOMMUNICATIONS CORPORATION 2,665
MURATA MANUFACTURING COMPANY JP 2,634