IPC Subgroup
H10N 30/072 by laminating or bonding of piezoelectric or electrostrictive bodies
Introduced: January 2023
Full Title
Piezoelectric or electrostrictive devices > Manufacture or treatment > Forming of piezoelectric or electrostrictive parts or bodies on an electrical element or another base > by laminating or bonding of piezoelectric or electrostrictive bodies
Classification Context
- Section:
- ELECTRICITY
- Class:
- SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- Subclass:
- ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
1 direct subcode
Child Classifications
Navigate with arrow keys, Enter to open
- H10N 30/073 by fusion of metals or by adhesives
Top Applicants
Top 10 applicants by patent filingsfor class H10, 2013–2023, worldwide · Source: EPO PATSTAT
- SAMSUNG DISPLAY KR 21,044
- SAMSUNG ELECTRONICS COMPANY KR 14,774
- LG DISPLAY COMPANY KR 9,454
- TAIWAN SEMICONDUCTOR MANUFACTURING COMPANY TW 8,301
- SEMICONDUCTOR ENERGY LABORATORY COMPANY JP 7,642
- BOE TECHNOLOGY GROUP COMPANY 6,845
- BOE TECHNOLOGY GROUP COMPANY CN 6,806
- SAMSUNG DISPLAY 6,577
- LG CHEM KR 5,461
- SEMICONDUCTOR ENERGY LABORATORY COMPANY 5,115