CPC Subgroup
H10N 30/072 by laminating or bonding of piezoelectric or electrostrictive bodies
Full Title
Piezoelectric or electrostrictive devices (integrated devices or assemblies of multiple devices H10N39/00) > Manufacture or treatment > Forming of piezoelectric or electrostrictive parts or bodies on an electrical element or another base > by laminating or bonding of piezoelectric or electrostrictive bodies
1 direct subcode
Child Classifications
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- H10N 30/073 by fusion of metals or by adhesives