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IPC Subgroup
H10P 50/24

of semiconductor materials

Introduced: January 2026

Full Title

Etching of wafers, substrates or parts of devices > Dry etching; Plasma etching; Reactive-ion etching > of semiconductor materials

Classification Context

Section:
ELECTRICITY
Class:
SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
Subclass:
GENERIC PROCESSES OR APPARATUS FOR THE MANUFACTURE OR TREATMENT OF DEVICES COVERED BY CLASS