IPC Subgroup
H10W 70/65 Shapes or dispositions of interconnections
Introduced: January 2026
Full Title
Package substrates; Interposers; Redistribution layers [RDL] > Insulating or insulated package substrates; Interposers; Redistribution layers > characterised by their interconnections > Shapes or dispositions of interconnections
Classification Context
- Section:
- ELECTRICITY
- Class:
- SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- Subclass:
- GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS
2 direct subcodes
Child Classifications
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- H10W 70/652 Cross-sectional shapes
- H10W 70/654 Top-view layouts