Package substrates; Interposers; Redistribution layers [RDL]

Classification Context

Section:

ELECTRICITY

Class:

SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR

Subclass:

GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS

Scope Notes

Glossary: redistribution layer redistribution layers interconnections in the package, such as metal traces or vias, that laterally reroute ("redistribute") the chip's input/output [I/O] layout into a different, desired I/O pad layout for external connections. Examples include: - fan-in RDLs [FI-RDL], i.e. for redistributing I/O signals from a larger chip to a smaller package substrate or interposer; and - fan-out RDLs [FO-RDLs], i.e. for redistributing I/O signals from a smaller chip to a larger package substrate or interposer.

Child Classifications

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• H10W 70/01 Manufacture or treatment
• H10W 70/2 Conductive package substrates serving as an interconnection, e.g. metal plates
• H10W 70/4 Leadframes
• H10W 70/6 Insulating or insulated package substrates; Interposers; Redistribution layers