Package substrates; Interposers; Redistribution layers [RDL]

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redistribution layer redistribution layers interconnections in the package, such as metal traces or vias, that laterally reroute ("redistribute") the chip's input/output [I/O] layout into a different, desired I/O pad layout for external connections. Examples include: - fan-in RDLs [FI-RDL], i.e. for redistributing I/O signals from a larger chip to a smaller package substrate or interposer; and - fan-out RDLs [FO-RDLs], i.e. for redistributing I/O signals from a smaller chip to a larger package substrate or interposer.