DIFF Subgroup
H10W 70/65 Shapes or dispositions of interconnections
Introduced: January 2026
Full Title
Full titles differ between systems:
IPC:
Package substrates; Interposers; Redistribution layers [RDL] > Insulating or insulated package substrates; Interposers; Redistribution layers > characterised by their interconnections > Shapes or dispositions of interconnections
CPC:
Package substrates; Interposers; Redistribution layers [RDL] > Insulating or insulated package substrates; Interposers; Redistribution layers (leadframes H10W70/40) > characterised by their interconnections > Shapes or dispositions of interconnections
CPC subdivides this area 3x more granularly than IPC with 3 additional codes.
3 codes are CPC-only extensions.
IPC defines codes here since 2026.
Child Classifications
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