Bond pads specially adapted therefor

Full Title

Interconnections or connectors in packages > Bump connectors, e.g. solder bumps or copper pillars; Dummy bumps; Thermal bumps > Bond pads specially adapted therefor

Classification Context

Section:

ELECTRICITY

Class:

SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR

Subclass:

GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS