Bump connectors, e.g. solder bumps or copper pillars; Dummy bumps; Thermal bumps

Full Title

Interconnections or connectors in packages > Bump connectors, e.g. solder bumps or copper pillars; Dummy bumps; Thermal bumps

Classification Context

Section:

ELECTRICITY

Class:

SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR

Subclass:

GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS

Scope Notes

Glossary: bump connector bump connectors a bump that provides electrical connection. Examples include solder balls or copper pillars.an electrically-conductive connector on the electrodes or bond pads of a chip or package part, for electrical connection between objects. Examples include solder balls or copper pillars. dummy bump dummy bumps a bump having similar properties to a bump connector (such as shape or material), for purposes other than electrical connection, such as mechanical connection. thermal bump thermal bumps a bump having similar properties to a bump connector (such as shape or material), for purposes other than electrical connection, such as for thermal connection between objects.

Child Classifications

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• H10W 72/29 Bond pads specially adapted therefor