Bump connectors, e.g. solder bumps or copper pillars; Dummy bumps; Thermal bumps

Filing statistics

The most active applicants in class H10 are SAMSUNG DISPLAY (21,044 applications), SAMSUNG ELECTRONICS COMPANY (14,774 applications) and LG DISPLAY COMPANY (9,454 applications).

Source: EPO PATSTAT, worldwide filings

Additional Content

bump connector bump connectors a bump that provides electrical connection. Examples include solder balls or copper pillars.an electrically-conductive connector on the electrodes or bond pads of a chip or package part, for electrical connection between objects. Examples include solder balls or copper pillars. dummy bump dummy bumps a bump having similar properties to a bump connector (such as shape or material), for purposes other than electrical connection, such as mechanical connection. thermal bump thermal bumps a bump having similar properties to a bump connector (such as shape or material), for purposes other than electrical connection, such as for thermal connection between objects.