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IPC Subgroup
H10W 72/3

Die-attach connectors

Introduced: January 2026

Full Title

Interconnections or connectors in packages > Die-attach connectors

Classification Context

Section:
ELECTRICITY
Class:
SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
Subclass:
GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS

Filing statistics

The most active applicants in class H10 are SAMSUNG DISPLAY (21,044 applications), SAMSUNG ELECTRONICS COMPANY (14,774 applications) and LG DISPLAY COMPANY (9,454 applications).

Source: EPO PATSTAT, worldwide filings

Additional Content

die-attach connector die-attach connectors a connector for bonding or mounting of a chip, primarily intended for mechanical connection. Examples include: (a) an insulating adhesive to connect the inactive surface of a chip to a package substrate; (b) a conductive solder or sintered layer to connect the inactive side of a chip to a leadframe.

Top Applicants

Top 10 applicants by patent filingsfor class H10, 2013–2023, worldwide · Source: EPO PATSTAT

  1. SAMSUNG DISPLAY KR 21,044
  2. SAMSUNG ELECTRONICS COMPANY KR 14,774
  3. LG DISPLAY COMPANY KR 9,454
  4. TAIWAN SEMICONDUCTOR MANUFACTURING COMPANY TW 8,301
  5. SEMICONDUCTOR ENERGY LABORATORY COMPANY JP 7,642
  6. BOE TECHNOLOGY GROUP COMPANY 6,845
  7. BOE TECHNOLOGY GROUP COMPANY CN 6,806
  8. SAMSUNG DISPLAY 6,577
  9. LG CHEM KR 5,461
  10. SEMICONDUCTOR ENERGY LABORATORY COMPANY 5,115