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IPC Subgroup
H10W 90/26

the stacked chips being of the same size without any chips being laterally offset, e.g. chip stacks having a rectangular shape

Introduced: January 2026

Full Title

Package configurations > Configurations of stacked chips > the stacked chips being of the same size without any chips being laterally offset, e.g. chip stacks having a rectangular shape

Classification Context

Section:
ELECTRICITY
Class:
SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
Subclass:
GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS