IPC Subgroup
H10W 90/26 the stacked chips being of the same size without any chips being laterally offset, e.g. chip stacks having a rectangular shape
Introduced: January 2026
Full Title
Package configurations > Configurations of stacked chips > the stacked chips being of the same size without any chips being laterally offset, e.g. chip stacks having a rectangular shape
Classification Context
- Section:
- ELECTRICITY
- Class:
- SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- Subclass:
- GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS