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IPC Subgroup
H10W 90/28

the stacked chips having different sizes, e.g. chip stacks having a pyramidal shape

Introduced: January 2026

Full Title

Package configurations > Configurations of stacked chips > the stacked chips having different sizes, e.g. chip stacks having a pyramidal shape

Classification Context

Section:
ELECTRICITY
Class:
SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
Subclass:
GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS