IPC Subgroup
H10W 90/28 the stacked chips having different sizes, e.g. chip stacks having a pyramidal shape
Introduced: January 2026
Full Title
Package configurations > Configurations of stacked chips > the stacked chips having different sizes, e.g. chip stacks having a pyramidal shape
Classification Context
- Section:
- ELECTRICITY
- Class:
- SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- Subclass:
- GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS