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PCE
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CPC Subgroup
C23F 1/20

for etching aluminium or alloys thereof

Full Title

Etching metallic material by chemical means (manufacture of printing surfaces B41C; manufacture of printed circuits H05K) > Etching compositions (C23F1/44 takes precedence) > Aqueous compositions > Acidic compositions (C23F1/42 takes precedence) > for etching aluminium or alloys thereof

Top Applicants

Top 10 applicants by patent filingsfor class C23, 2013–2023, worldwide · Source: EPO PATSTAT

  1. APPLIED MATERIALS US 10,596
  2. TOKYO ELECTRON JP 5,229
  3. LAM RESEARCH CORPORATION US 3,622
  4. NIPPON STEEL CORPORATION JP 3,171
  5. JFE STEEL JP 3,128
  6. ASM IP HOLDING NL 2,722
  7. ARCELORMITTAL LU 2,481
  8. TOKYO ELECTRON 2,359
  9. APPLIED MATERIALS 2,284
  10. CHINESE ACADEMY OF SCIENCES 2,110