CPC Subgroup Additional Only
H01J 2237/31 Processing objects on a macro-scale
Full Title
Discharge tubes exposing object to beam, e.g. for analysis treatment, etching, imaging > Electron or ion beam tubes for processing objects > Processing objects on a macro-scale
12 direct subcodes
Child Classifications
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- H01J 2237/3104 Welding
- H01J 2237/3109 Cutting
- H01J 2237/3114 Machining
- H01J 2237/3118 Drilling
- H01J 2237/3123 Casting
- H01J 2237/3128 Melting
- H01J 2237/3132 Evaporating
- H01J 2237/3142 Ion plating
- H01J 2237/3151 Etching
- H01J 2237/3156 Curing
- H01J 2237/316 Changing physical properties
- H01J 2237/3165 Changing chemical properties
Top Applicants
Top 10 applicants by patent filingsfor class H01, 2013–2023, worldwide · Source: EPO PATSTAT
- SAMSUNG ELECTRONICS COMPANY KR 37,897
- TAIWAN SEMICONDUCTOR MANUFACTURING COMPANY TW 36,116
- APPLIED MATERIALS US 21,640
- LG ENERGY SOLUTION KR 20,770
- LG CHEM KR 19,835
- TOKYO ELECTRON JP 18,519
- ROBERT BOSCH DE 14,595
- INTEL CORPORATION US 13,580
- MURATA MANUFACTURING COMPANY JP 12,151
- SAMSUNG SDI COMPANY KR 12,080