CPC Main Group Additional Only
H01J 2237/00 Discharge tubes exposing object to beam, e.g. for analysis treatment, etching, imaging
23 direct subcodes
Child Classifications
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- H01J 2237/002 Cooling arrangements
- H01J 2237/004 Charge control of objects or beams
- H01J 2237/006 Details of gas supplies, e.g. in an ion source, to a beam line, to a specimen or to a workpiece, (H01J37/3244 takes precedence; environmental cells for electron microscopes H01J2237/2003; microscopes with environmental specimen chamber H01J2237/2608)
- H01J 2237/02 Details
- H01J 2237/03 Mounting, supporting, spacing or insulating electrodes
- H01J 2237/04 Means for controlling the discharge
- H01J 2237/05 Arrangements for energy or mass analysis
- H01J 2237/06 Sources
- H01J 2237/10 Lenses
- H01J 2237/15 Means for deflecting or directing discharge
- H01J 2237/153 Correcting image defects, e.g. stigmators
- H01J 2237/16 Vessels
- H01J 2237/18 Vacuum control means
- H01J 2237/20 Positioning, supporting, modifying or maintaining the physical state of objects being observed or treated
- H01J 2237/21 Focus adjustment
- H01J 2237/22 Treatment of data
- H01J 2237/244 Detection characterized by the detecting means
- H01J 2237/245 Detection characterised by the variable being measured
- H01J 2237/248 Components associated with the control of the tube
- H01J 2237/25 Tubes for localised analysis using electron or ion beams
Top Applicants
Top 10 applicants by patent filingsfor class H01, 2013–2023, worldwide · Source: EPO PATSTAT
- SAMSUNG ELECTRONICS COMPANY KR 37,897
- TAIWAN SEMICONDUCTOR MANUFACTURING COMPANY TW 36,116
- APPLIED MATERIALS US 21,640
- LG ENERGY SOLUTION KR 20,770
- LG CHEM KR 19,835
- TOKYO ELECTRON JP 18,519
- ROBERT BOSCH DE 14,595
- INTEL CORPORATION US 13,580
- MURATA MANUFACTURING COMPANY JP 12,151
- SAMSUNG SDI COMPANY KR 12,080