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IPC Subgroup
H05K 1/182

associated with components mounted in printed circuit boards [PCB], e.g. insert-mounted components [IMC]

Introduced: January 2026

Full Title

Printed circuits > structurally associated with non-printed electric components > associated with components mounted in printed circuit boards [PCB], e.g. insert-mounted components [IMC]

Classification Context

Section:
ELECTRICITY
Class:
ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Subclass:
PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS

3 direct subcodes

Child Classifications

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  • H05K 1/183 associated with components mounted in and supported by recessed areas of the PCBs
  • H05K 1/184 associated with components inserted in holes through the PCBs and wherein terminals of the components are connected to printed contacts on the walls of the holes or at the edges thereof or protruding over or into the holes
  • H05K 1/185 associated with components encapsulated in the insulating substrate of the PCBs; associated with components incorporated in internal layers of multilayer circuit boards

Top Applicants

Top 10 applicants by patent filingsfor class H05, 2013–2023, worldwide · Source: EPO PATSTAT

  1. SAMSUNG ELECTRONICS COMPANY KR 7,201
  2. PANASONIC INTELLECTUAL PROPERTY 6,828
  3. SEMICONDUCTOR ENERGY LABORATORY COMPANY 3,988
  4. LG ELECTRONICS KR 3,564
  5. PANASONIC INTELLECTUAL PROPERTY JP 3,533
  6. SAMSUNG DISPLAY KR 3,310
  7. FUJI JP 2,870
  8. SAMSUNG ELECTRO-MECHANICS COMPANY KR 2,675
  9. GUANGDONG OPPO MOBILE TELECOMMUNICATIONS CORPORATION 2,665
  10. MURATA MANUFACTURING COMPANY JP 2,634