Metal processing

Full Title

Indexing scheme relating to apparatus or processes for manufacturing printed circuits covered by H05K3/00 > Metal processing

Child Classifications

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• H05K 2203/0307 Providing micro- or nanometer scale roughness on a metal surface, e.g. by plating of nodules or dendrites
• H05K 2203/0315 Oxidising metal
• H05K 2203/0323 Working metal substrate or core, e.g. by etching, deforming
• H05K 2203/033 Punching metal foil, e.g. solder foil
• H05K 2203/0338 Transferring metal or conductive material other than a circuit pattern, e.g. bump, solder, printed component
• H05K 2203/0346 Deburring, rounding, bevelling or smoothing conductor edges
• H05K 2203/0353 Making conductive layer thin, e.g. by etching
• H05K 2203/0361 Stripping a part of an upper metal layer to expose a lower metal layer, e.g. by etching or using a laser
• H05K 2203/0369 Etching selective parts of a metal substrate through part of its thickness, e.g. using etch resist
• H05K 2203/0376 Etching temporary metallic carrier substrate
• H05K 2203/0384 Etch stop layer, i.e. a buried barrier layer for preventing etching of layers under the etch stop layer
• H05K 2203/0392 Pretreatment of metal, e.g. before finish plating, etching