Related to the order of processing steps

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Indexing scheme relating to apparatus or processes for manufacturing printed circuits covered by H05K3/00 > Related to the order of processing steps

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• H05K 2203/1407 Applying catalyst before applying plating resist
• H05K 2203/1415 Applying catalyst after applying plating resist
• H05K 2203/1423 Applying catalyst before etching, e.g. plating catalyst in holes before etching circuit
• H05K 2203/143 Treating holes before another process, e.g. coating holes before coating the substrate
• H05K 2203/1438 Treating holes after another process, e.g. coating holes after coating the substrate
• H05K 2203/1446 Treatment after insertion of lead into hole, e.g. bending, cutting, caulking or curing of adhesive but excluding soldering
• H05K 2203/1453 Applying the circuit pattern before another process, e.g. before filling of vias with conductive paste, before making printed resistors
• H05K 2203/1461 Applying or finishing the circuit pattern after another process, e.g. after filling of vias with conductive paste, after making printed resistors
• H05K 2203/1476 Same or similar kind of process performed in phases, e.g. coarse patterning followed by fine patterning
• H05K 2203/1484 Simultaneous treatments, e.g. soldering lead-in-hole components simultaneously with surface mounted components
• H05K 2203/1492 Periodical treatments, e.g. pulse plating of through-holes