in which conductive material is applied to the insulating support in such a manner as to form the desired conductive pattern

Full Title

Apparatus or processes for manufacturing printed circuits > in which conductive material is applied to the insulating support in such a manner as to form the desired conductive pattern

10 direct subcodes

Child Classifications

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H05K 3/101
H05K 3/102
H05K 3/103
H05K 3/105
H05K 3/107
H05K 3/108
H05K 3/12 using printing techniques to apply the conductive material
H05K 3/14 using spraying techniques to apply the conductive material
H05K 3/18 using precipitation techniques to apply the conductive material
H05K 3/20 by affixing prefabricated conductor pattern

Top Applicants

Top 10 applicants by patent filingsfor class H05, 2013–2023, worldwide · Source: EPO PATSTAT

SAMSUNG ELECTRONICS COMPANY KR 9,981
SAMSUNG DISPLAY KR 5,041
LG ELECTRONICS KR 4,742
PHILIP MORRIS PRODUCTS CH 4,411
PANASONIC INTELLECTUAL PROPERTY JP 3,915
PANASONIC INTELLECTUAL PROPERTY 3,471
SAMSUNG ELECTRO-MECHANICS COMPANY KR 3,210
MURATA MANUFACTURING COMPANY JP 3,191
FUJI JP 2,987
SIGNIFY HOLDING NL 2,907