in which the conductive material is applied to the surface of the insulating support and is thereafter removed from such areas of the surface which are not intended for current conducting or shielding

Full Title

Apparatus or processes for manufacturing printed circuits > in which the conductive material is applied to the surface of the insulating support and is thereafter removed from such areas of the surface which are not intended for current conducting or shielding

Child Classifications

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• H05K 3/022
• H05K 3/027
• H05K 3/04 the conductive material being removed mechanically, e.g. by punching
• H05K 3/06 the conductive material being removed chemically or electrolytically, e.g. by photo-etch process
• H05K 3/08 the conductive material being removed by electric discharge, e.g. by spark erosion