CPC Subgroup
H10W 20/40 Interconnections external to wafers or substrates, e.g. back-end-of-line [BEOL] metallisations or vias connecting to gate electrodes
Full Title
Interconnections in chips, wafers or substrates > Interconnections external to wafers or substrates, e.g. back-end-of-line [BEOL] metallisations or vias connecting to gate electrodes
8 direct subcodes
Child Classifications
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- H10W 20/41 characterised by their conductive parts
- H10W 20/45 characterised by their insulating parts
- H10W 20/49 Adaptable interconnections, e.g. fuses or antifuses