CPC Subgroup
H10W 70/654 Top-view layouts
Full Title
Package substrates; Interposers; Redistribution layers [RDL] > Insulating or insulated package substrates; Interposers; Redistribution layers (leadframes H10W70/40) > characterised by their interconnections > Shapes or dispositions of interconnections > Top-view layouts
2 direct subcodes
Child Classifications
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- H10W 70/655 Fan-out layouts
- H10W 70/656 Fan-in layouts