DIFF Subgroup
H10W 70/654 Top-view layouts
Introduced: January 2026
Full Title
Full titles differ between systems:
IPC:
Package substrates; Interposers; Redistribution layers [RDL] > Insulating or insulated package substrates; Interposers; Redistribution layers > characterised by their interconnections > Shapes or dispositions of interconnections > Top-view layouts
CPC:
Package substrates; Interposers; Redistribution layers [RDL] > Insulating or insulated package substrates; Interposers; Redistribution layers (leadframes H10W70/40) > characterised by their interconnections > Shapes or dispositions of interconnections > Top-view layouts
IPC and CPC are identically structured here. All 2 subcodes exist in both systems.
IPC defines codes here since 2026.
Child Classifications
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