CPC Main Group
H10W 72/00 Interconnections or connectors in packages
Filing statistics
The most active applicants in class H10 are SAMSUNG DISPLAY (38,446 applications), TAIWAN SEMICONDUCTOR MANUFACTURING COMPANY (30,922 applications) and SAMSUNG ELECTRONICS COMPANY (30,059 applications).
Source: EPO PATSTAT, worldwide filings
14 direct subcodes
Child Classifications
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- H10W 72/20 Bump connectors, e.g. solder bumps or copper pillars; Dummy bumps; Thermal bumps
- H10W 72/30 Die-attach connectors
- H10W 72/40 Anisotropic conductive adhesives
- H10W 72/50 Bond wires
- H10W 72/60 Strap connectors, e.g. thick copper clips for grounding of power devices
- H10W 72/90 Bond pads, in general
Top Applicants
Top 10 applicants by patent filingsfor class H10, 2013–2023, worldwide · Source: EPO PATSTAT
- SAMSUNG DISPLAY KR 38,446
- TAIWAN SEMICONDUCTOR MANUFACTURING COMPANY TW 30,922
- SAMSUNG ELECTRONICS COMPANY KR 30,059
- BOE TECHNOLOGY GROUP COMPANY CN 20,304
- LG DISPLAY COMPANY KR 17,772
- BOE TECHNOLOGY GROUP COMPANY 15,621
- SEMICONDUCTOR ENERGY LABORATORY COMPANY JP 13,629
- IBM (INTERNATIONAL BUSINESS MACHINES CORPORATION) US 11,750
- SAMSUNG DISPLAY 11,316
- SEMICONDUCTOR ENERGY LABORATORY COMPANY 9,697