CPC Main Group
H10W 72/00 Interconnections or connectors in packages
14 direct subcodes
Child Classifications
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- H10W 72/20 Bump connectors, e.g. solder bumps or copper pillars; Dummy bumps; Thermal bumps
- H10W 72/30 Die-attach connectors
- H10W 72/40 Anisotropic conductive adhesives
- H10W 72/50 Bond wires
- H10W 72/60 Strap connectors, e.g. thick copper clips for grounding of power devices
- H10W 72/90 Bond pads, in general