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DIFF Subgroup
C23C 16/22

characterised by the deposition of inorganic material, other than metallic material

Introduced: January 1985

Full Title

Full titles differ between systems:

IPC:

Chemical coating by decomposition of gaseous compounds, without leaving reaction products of surface material in the coating, i.e. chemical vapour deposition [CVD] processes > characterised by the deposition of inorganic material, other than metallic material

CPC:

Chemical coating by decomposition of gaseous compounds, without leaving reaction products of surface material in the coating, i.e. chemical vapour deposition [CVD] processes (reactive sputtering or vacuum evaporation C23C14/00) > characterised by the deposition of inorganic material, other than metallic material

IPC and CPC are identically structured here. All 4 subcodes exist in both systems.

IPC defines codes here since 1985.

Child Classifications

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  • C23C 16/24 Deposition of silicon only since 1985 IPC+CPC Available in IPC and CPC
  • C23C 16/28 Deposition of only one other non-metal element since 1985 IPC+CPC Available in IPC and CPC

Top Applicants

Top Applicants (IPC)

Class C23,2013–2023, worldwide · Source: EPO PATSTAT

  1. APPLIED MATERIALS US 8,096
  2. TOKYO ELECTRON JP 3,985
  3. CHINESE ACADEMY OF SCIENCES 2,842
  4. LAM RESEARCH CORPORATION US 2,654
  5. TOKYO ELECTRON 2,540
  6. NIPPON STEEL CORPORATION JP 2,465
  7. JFE STEEL JP 2,368
  8. ASM IP HOLDING NL 2,092
  9. APPLIED MATERIALS 1,877
  10. POSCO (POHANG IRON AND STEEL COMPANY) KR 1,782

Top Applicants (CPC)

Class C23,2013–2023, worldwide · Source: EPO PATSTAT

  1. APPLIED MATERIALS US 10,596
  2. TOKYO ELECTRON JP 5,229
  3. LAM RESEARCH CORPORATION US 3,622
  4. NIPPON STEEL CORPORATION JP 3,171
  5. JFE STEEL JP 3,128
  6. ASM IP HOLDING NL 2,722
  7. ARCELORMITTAL LU 2,481
  8. TOKYO ELECTRON 2,359
  9. APPLIED MATERIALS 2,284
  10. CHINESE ACADEMY OF SCIENCES 2,110