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DIFF Subgroup
G11C 29/10

Test algorithms, e.g. memory scan [MScan] algorithms; Test patterns, e.g. checkerboard patterns

Introduced: January 2006

Full Title

Full titles differ between systems:

IPC:

Checking stores for correct operation; Testing stores during standby or offline operation > Detection or location of defective memory elements > Functional testing, e.g. testing during refresh, power-on self testing [POST] or distributed testing > Test algorithms, e.g. memory scan [MScan] algorithms; Test patterns, e.g. checkerboard patterns

CPC:

Checking stores for correct operation ; Testing stores during standby or offline operation > Detection or location of defective memory elements > Functional testing, e.g. testing during refresh, power-on self testing [POST] or distributed testing > Test algorithms, e.g. memory scan [MScan] algorithms; Test patterns, e.g. checkerboard patterns

No child classifications to compare. This is a leaf node in both IPC and CPC.

Top Applicants

Top Applicants (IPC)

Class G11,2013–2023, worldwide · Source: EPO PATSTAT

  1. MICRON TECHNOLOGY US 10,574
  2. SK HYNIX KR 9,138
  3. SAMSUNG ELECTRONICS COMPANY KR 9,004
  4. TAIWAN SEMICONDUCTOR MANUFACTURING COMPANY TW 3,739
  5. IBM (INTERNATIONAL BUSINESS MACHINES CORPORATION) US 3,443
  6. INTEL CORPORATION US 2,952
  7. SANDISK TECHNOLOGIES US 2,905
  8. WESTERN DIGITAL TECHNOLOGIES US 2,630
  9. TOSHIBA CORPORATION JP 2,593
  10. SEAGATE TECHNOLOGY US 2,472

Top Applicants (CPC)

Class G11,2013–2023, worldwide · Source: EPO PATSTAT

  1. MICRON TECHNOLOGY US 12,397
  2. SAMSUNG ELECTRONICS COMPANY KR 12,238
  3. SK HYNIX KR 11,371
  4. TAIWAN SEMICONDUCTOR MANUFACTURING COMPANY TW 4,601
  5. INTEL CORPORATION US 3,874
  6. IBM (INTERNATIONAL BUSINESS MACHINES CORPORATION) US 3,866
  7. SANDISK TECHNOLOGIES US 3,151
  8. SK HYNIX 3,143
  9. SAMSUNG ELECTRONICS COMPANY 3,073
  10. WESTERN DIGITAL TECHNOLOGIES US 2,961