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DIFF Subgroup
H05K 1/185

associated with components encapsulated in the insulating substrate of the PCBs; associated with components incorporated in internal layers of multilayer circuit boards

Introduced: January 2026

Full Title

Full titles differ between systems:

IPC:

Printed circuits > structurally associated with non-printed electric components > associated with components mounted in printed circuit boards [PCB], e.g. insert-mounted components [IMC] > associated with components encapsulated in the insulating substrate of the PCBs; associated with components incorporated in internal layers of multilayer circuit boards

CPC:

Printed circuits > structurally associated with non-printed electric components (H05K1/16 takes precedence) > associated with components mounted in printed circuit boards [PCB], e.g. insert-mounted components [IMC] > associated with components encapsulated in the insulating substrate of the PCBs; associated with components incorporated in internal layers of multilayer circuit boards

Additional Content IPC

Manufacture or treatment of semiconductor packages by depositing layers on chips or wafers extending onto an encapsulation that laterally surrounds the chip or wafer, e.g. fan-out wafer level package [FOWLP] RDLs Fan-out layouts of interconnections in insulating or insulated package substrates, interposers or redistribution layers [RDL] of semiconductor or solid-state devices

Of 2 combined children, 0 exist in both systems.

2 codes are CPC-only extensions.

Child Classifications

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Top Applicants

Top Applicants (IPC)

Class H05,2013–2023, worldwide · Source: EPO PATSTAT

  1. SAMSUNG ELECTRONICS COMPANY KR 7,201
  2. PANASONIC INTELLECTUAL PROPERTY 6,828
  3. SEMICONDUCTOR ENERGY LABORATORY COMPANY 3,988
  4. LG ELECTRONICS KR 3,564
  5. PANASONIC INTELLECTUAL PROPERTY JP 3,533
  6. SAMSUNG DISPLAY KR 3,310
  7. FUJI JP 2,870
  8. SAMSUNG ELECTRO-MECHANICS COMPANY KR 2,675
  9. GUANGDONG OPPO MOBILE TELECOMMUNICATIONS CORPORATION 2,665
  10. MURATA MANUFACTURING COMPANY JP 2,634

Top Applicants (CPC)

Class H05,2013–2023, worldwide · Source: EPO PATSTAT

  1. SAMSUNG ELECTRONICS COMPANY KR 9,981
  2. SAMSUNG DISPLAY KR 5,041
  3. LG ELECTRONICS KR 4,742
  4. PHILIP MORRIS PRODUCTS CH 4,411
  5. PANASONIC INTELLECTUAL PROPERTY JP 3,915
  6. PANASONIC INTELLECTUAL PROPERTY 3,471
  7. SAMSUNG ELECTRO-MECHANICS COMPANY KR 3,210
  8. MURATA MANUFACTURING COMPANY JP 3,191
  9. FUJI JP 2,987
  10. SIGNIFY HOLDING NL 2,907