H05K 1/185 associated with components encapsulated in the insulating substrate of the PCBs; associated with components incorporated in internal layers of multilayer circuit boards
Introduced: January 2026
Full Title
Full titles differ between systems:
Printed circuits > structurally associated with non-printed electric components > associated with components mounted in printed circuit boards [PCB], e.g. insert-mounted components [IMC] > associated with components encapsulated in the insulating substrate of the PCBs; associated with components incorporated in internal layers of multilayer circuit boards
Printed circuits > structurally associated with non-printed electric components (H05K1/16 takes precedence) > associated with components mounted in printed circuit boards [PCB], e.g. insert-mounted components [IMC] > associated with components encapsulated in the insulating substrate of the PCBs; associated with components incorporated in internal layers of multilayer circuit boards
Of 2 combined children, 0 exist in both systems.
2 codes are CPC-only extensions.
Child Classifications
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