associated with components encapsulated in the insulating substrate of the PCBs; associated with components incorporated in internal layers of multilayer circuit boards

Full Title

Printed circuits > structurally associated with non-printed electric components > associated with components mounted in printed circuit boards [PCB], e.g. insert-mounted components [IMC] > associated with components encapsulated in the insulating substrate of the PCBs; associated with components incorporated in internal layers of multilayer circuit boards

Classification Context

Section:

ELECTRICITY

Class:

ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR

Subclass:

PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS

Scope Notes

Application references: Manufacture or treatment of semiconductor packages by depositing layers on chips or wafers extending onto an encapsulation that laterally surrounds the chip or wafer, e.g. fan-out wafer level package [FOWLP] RDLs Fan-out layouts of interconnections in insulating or insulated package substrates, interposers or redistribution layers [RDL] of semiconductor or solid-state devices