DIFF Subgroup
H05K 3/04 the conductive material being removed mechanically, e.g. by punching
Introduced: September 1968
Full Title
Apparatus or processes for manufacturing printed circuits > in which the conductive material is applied to the surface of the insulating support and is thereafter removed from such areas of the surface which are not intended for current conducting or shielding > the conductive material being removed mechanically, e.g. by punching
Of 4 combined children, 0 exist in both systems.
4 codes are CPC-only extensions.
Child Classifications
Navigate with arrow keys, Enter to open